Recrystallization Behavior at Diffusion Bonding Interface of High Nb Containing TiAl Alloy
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- 作者：Bin Tang ; Xian Sheng Qi ; Hong Chao Kou ; Jin Shan Li and Srdjan Milenkovic
- 刊名：Advanced Engineering Materials
- 出版年：2016
- 出版时间：April 2016
- 年：2016
- 卷：18
- 期：4
- 页码：657-664
- 全文大小：2707K
- ISSN：1527-2648
文摘
A series of diffusion bonding tests are conducted on a high Nb containing TiAl alloy with full lamellar (FL) microstructure and the effect of interfacial recrystallization behavior on the shear strength is discussed. Microstructural observations reveal that bonding above 1 100 °C and 30 MPa results in recrystallization at the bonding interface flanked by FL microstructure, thus promoting the interface migration and leading to a sound joint. Based on the present results, the nucleation mechanism of recrystallization at the bonding interface is studied. Shear testing results show that recrystallization at the bonded zone improves the bonding quality of the joints by changing the failure mode. The shear strength of the joints attains 400 MPa when bonding at 1 150 °C/30 MPa/45 min and 1 100 °C/40 MPa/45 min.