Influence of Ce addition on Sn-3.0Ag-0.5Cu solder joints: Thermal behavior, microstructure and mechanical properties

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• 作者：Xiaoxuan Tu^a ; ^b ; Danqing Yi^a ; ^b ; Jing Wu^c ; Bin Wang^a ; ^b ; ^{wangbin325@263.net}
• 关键词：SAC305-xCe solder joints ; Thermal behavior ; Intermetallic compounds evolution ; Mechanical properties
• 刊名：Journal of Alloys and Compounds
• 出版年：2017
• 出版时间：25 March 2017
• 年：2017
• 卷：698
• 期：Complete
• 页码：317-328
• 全文大小：6726 K
• 卷排序：698

文摘

We studied effects of Ce addition on properties of Sn-3.0Ag-0.5Cu (SAC305). The microstructure and thermal and mechanical properties were analyzed. Addition of Ce facilitated the formation of Ag3Sn and improved strength of joints. Best mechanical performance was achieved for SAC305 joints with 0.15 wt% Ce.