Investigation of microstructure and mechanical properties of Sn-xCu solder alloys

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• 作者：A.F. Abd El-Rehim^a ; ^b ; ^{alaa.abdelrehim@kku.edu.sa} ; H.Y. Zahran^a ; ^b
• 关键词：Sn-Cu solder alloys ; Indentation creep properties ; Microstructure ; Activation energy
• 刊名：Journal of Alloys and Compounds
• 出版年：2017
• 出版时间：25 February 2017
• 年：2017
• 卷：695
• 期：Complete
• 页码：3666-3673
• 全文大小：2699 K
• 卷排序：695

文摘

The effect of Cu content on the microstructure and mechanical properties of Sn-Cu alloys has been studied. The results showed that the Sn-4wt% Cu solder alloy exhibited the best creep resistance. The values of activation energy were found to be consistent with dislocation core diffusion mechanism.