Effect of Sn grain orientation on formation of Cu₆Sn₅ intermetallic compounds during electromigration

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• 作者：Yu-An Shen ; Chih Chen ; ^{chih@mail.nctu.edu.tw" class="auth_mail" title="E-mail the corresponding author}
• 关键词：Grain orientation ; Anisotropic diffusion ; Intermetallic compounds ; Electromigration
• 刊名：Scripta Materialia
• 出版年：2017
• 出版时间：February 2017
• 年：2017
• 卷：128
• 期：Complete
• 页码：6-9
• 全文大小：878 K

文摘

The effects of Sn orientation and grain boundary misorientation on formation of Cu-Sn intermetallic compounds (IMCs) during electromigration were investigated. Significant anisotropic diffusion of Cu in Sn grains was observed. Interfacial Cu-Sn IMCs may grow rapidly, dissolve, or remain intact, depending on the angle of c-axis of Sn grains with the electron flow. In addition, grain boundaries did not play an important role in Cu diffusion because they are mostly cyclic twins.