Implantation of Cuion in Stainless Steel by MEVVA ion source and Molecular Dynamic Simulation

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• 作者：Jie Yua ; Jingchao Chena ; ^{cjingchao@hotmail.com} ; Rong Chena ; Wei Yea
• 关键词：ion implantation ; antibacterial ; stainless steel ; molecular dynamic
• 刊名：Procedia Engineering
• 出版年：2012
• 出版时间：2012
• 年：2012
• 卷：31
• 期：Complete
• 页码：595-599
• 全文大小：465 K

文摘

Cuions were implanted to A304 stainless steel by MEVVA ion source. After heat treatment, X-ray show that the precipitation phase is Cu3Fe4 and Cu4Fe although the phase diagram show the solid solution. The implantation process were simulated by molecular dynamic software for the diffusion paths of Cu ion. The simulation result show that: during implant process, Cu ions were implanted to stainless steel by means of replacement and interval position, the surface lattice were damaged therefore in a armorphous condition and during heat treatment .Cu have the tends of precipitation to form intermediate phase in the surface.