Effect of phase separation on mechanical strength of co-sputtering Cu(Ti) thin film in chip-level 3DIC bonding

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• 作者：Po Chen Lin ; Hao Chen ; Hsien-Chien Hsieh ; Albert T. Wu ; ^{atwu@ncu.edu.tw}
• 关键词：Electronic materials ; Sputtering ; Phase separation ; Cu bonding ; Co-sputtered Cu(Ti) ; Shear test
• 刊名：Materials Letters
• 出版年：2017
• 出版时间：15 February 2017
• 年：2017
• 卷：189
• 期：Complete
• 页码：93-96
• 全文大小：438 K
• 卷排序：189

文摘

Co-sputtered Cu(Ti) were used for Cu bond through face-to-face thermocompression. Diffusion behaviors and bonding strengths for various Ti contents were analyzed. Phase separation of Cu and Ti yields a void-free interface and strong Cu-Cu bonds.