The influence of pulse plating frequency and duty cycle on the microstructure and stress state of electroplated copper films

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• 作者：James B. Marro^a ; ^b ; ^{jmarro@g.clemson.edu} ; Taghi Darroudi^c ; ^{tdarrou@clemson.edu} ; Chukwudi A. Okoro^d ; ^{chukwudi.okoro@nist.org} ; Yaw S. Obeng^d ; ^{yaw.obeng@nist.org} ; Kathleen C. Richardson^a ; ^b ; ^{kcr@creol.ucf.edu}
• 关键词：Copper ; Microstructure ; Electrodeposition ; Twins ; Stress
• 刊名：Thin Solid Films
• 出版年：2017
• 出版时间：1 January 2017
• 年：2017
• 卷：621
• 期：Complete
• 页码：91-97
• 全文大小：1697 K
• 卷排序：621

文摘

Duty cycle and frequency of the pulse current influenced the surface grain size. Pulse on-time affected the amount of (111), (100), and (311) oriented grains. Films deposited at lower frequencies had higher biaxial stresses. A correlation between biaxial stress and twin density was observed. It is proposed that the twin density can be influenced by Cu grain size.