Effect of thermal and load cycle on thermal contact conductance across dissimilar joints at cryogenic temperature

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• 作者：Reji Joseph^a ; ^{rejijoseph70@gmail.com} ; Jophy Peter^a ; S. Sunil Kumar^a ; N. Asok Kumar^b
• 关键词：Thermal contact conductance ; Cryogenic ; Load cycle ; Thermal cycle ; Dissimilar joint ; Hysteresis
• 刊名：Applied Thermal Engineering
• 出版年：2017
• 出版时间：25 January 2017
• 年：2017
• 卷：111
• 期：Complete
• 页码：1622-1628
• 全文大小：1541 K
• 卷排序：111

文摘

Thermal Contact Conductance (TCC) at low temperature is of keen interest to researchers in the fields of aerospace, superconductivity, high speed semiconductor devices, cryogenic interfaces, etc. Change in thermal contact conductance at low temperature is associated with different factors like differential contraction, radial deformation of asperities and improved mechanical properties. When the joints undergo thermal, load or combined thermal and load cycles, changes in thermal contact conductance and heat flow across the joint are expected. In this work, experimental investigation of dissimilar metallic joints with temperature and load cycles was taken up. Joints formed by titanium alloy, stainless steel and aluminium alloy were considered for the study. Variation in thermal contact conductance across different joints with thermal and load cycles were investigated. The hysteresis associated with thermal contact conductance after load and temperature cycling was evaluated. The hysteresis effects are more for aluminium alloy joints which is known to have low hardness and high conductivity.