Two-phase mini-thermosyphon electronics cooling: Dynamic modeling, experimental validation and application to 2U servers
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- 作者：Nicolas Lamaison ; Chin Lee Ong ; Jackson B. Marcinichen ; John R. Thome ; john.thome@epfl.ch" class="auth_mail" title="E-mail the corresponding author
- 关键词：2U server ; Cooling ; Flow boiling ; Thermosyphon ; Microchannels ; Dynamic modeling
- 刊名：Applied Thermal Engineering
- 出版年：2017
- 出版时间：5 January 2017
- 年：2017
- 卷：110
- 期：Complete
- 页码：481-494
- 全文大小：3761 K
文摘
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Novel dynamic modeling of a microchannel-based thermosyphon is presented/validated.
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A geometry is proposed/simulated for the retrofitting of a commercial 2U-server.
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Both stable and unstable solutions are found for the steady-state.
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A riser diameter increase of 30% led up to 60% increase in flow rate.
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The flow self-redistributes into the highest heat load CPU during parallel cooling.
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