Microstructure and mechanical properties of as-reflowed Sn58Bi composite solder pastes
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- 作者：Yang Liu ; Dr. ; lyang805@163.com" class="auth_mail" title="E-mail the corresponding author ; Haifeng Fu ; Fenglian Sun ; Hao Zhang ; Xiangxia Kong ; Tong Xin
- 关键词：SnBi ; SAC-BN ; Solder paste ; Microstructure ; Mechanical property
- 刊名：Journal of Materials Processing Technology
- 出版年：2016
- 出版时间：December 2016
- 年：2016
- 卷：238
- 期：Complete
- 页码：290-296
- 全文大小：4385 K
文摘
The differential scanning calorimetric curve of the composite SnBi solder paste with SAC-BN particles presents two endothermal areas representing the eutectic SnBi and SAC-BN alloys, respectively. The differential scanning calorimetric curve of the reflowed solder shows only one endothermal area at the liquidus temperature of 170 °C. With the increasing amount of SAC-BN particles in the composite solder pastes, the concentration of Sn-rich phases increase significantly. The grain size of β-Sn matrix grows due to adding SAC-BN particles into the composite solder pastes in the range of 0 to 8 wt%. Further addition of the doped particles leads to grain refinement in the solder bulks. Based on the microstructure transformation, the hardness and the elastic modulus of the solder bulks decrease as the percentage of doped particles varies from 0 to 8 wt%, but increase when the doped percentage is higher than 8 wt%. The solder bulk with 8 wt% SAC-BN particles addition shows the minimum hardness and elastic modulus, which are 164.1 MPa and 16.8 GPa, respectively.