Parameters Analysis of TSV Filling Models of Distinct Chemical Behaviours of Additives

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• 作者：Yan Wang^a ; ^b ; Wenhui Zhu^a ; ^b ; ^{zhuwenhui@csu.edu.cn} ; Xiang Li^c ; Fuliang Wang^a ; ^b ; ^{wangfuliang@csu.edu.cn}
• 关键词：Additives ; Filling Models ; Copper electrodeposition
• 刊名：Electrochimica Acta
• 出版年：2016
• 出版时间：10 December 2016
• 年：2016
• 卷：221
• 期：Complete
• 页码：70-79
• 全文大小：2181 K
• 卷排序：221

文摘

Four types of via-filling models are developed in this paper, considering distinct chemical behaviour of additives used in the TSV electroplating. The surface convection, surface diffusion and the effect of the curvature are considered in the equation of the coverage of additives, which is solved by a weak form of the PDEs. The simulation results of the different models are compared. Sensitivity analyses of the important parameters in the four models are conducted. Thus, the influences of parameters on the via-filling process are investigated. Conclusions are drawn based on the analysis of the developed numerical models.