Hot press bonding of γ-TiAl and TC17 at a low bonding temperature by imposing plastic deformation and post heating
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- 作者：Hong Li ; lihong86@nwpu.edu.cn" class="auth_mail" title="E-mail the corresponding author ; Chao Yang ; Lixing Sun ; Miaoquan Li
- 关键词：γ-TiAl ; Press bonding ; Plastic deformation ; Diffusion zone ; Microstructure ; Microhardness
- 刊名：Materials Letters
- 出版年：2017
- 出版时间：15 January 2017
- 年：2017
- 卷：187
- 期：Complete
- 页码：4-6
- 全文大小：772 K
文摘
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The temperature to join TiAl/Ti is reduced to 850 °C by plastic deformation and heating.
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Plastic deformation and heating promote the void shrinking and increasing of diffusion zone width.
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Plastic deformation and heating enhance the atom diffusion across bond line.
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A sound bond with the microhardness in a narrow range of 314–345 HV is obtained.
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