Ultrasonic-promoted rapid TLP bonding of fine-grained 7034 high strength aluminum alloys

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• 作者：Weibing Guo ; Xuesong Leng ; Tianmin Luan ; Jiuchun Yan ; ^{jcyan@hit.edu.cn} ; Jingshan He
• 关键词：Fine-grained aluminum alloy ; Zn interlayer ; Ultrasonic ; TLP bonding ; Microstructure ; Shear strength
• 刊名：Ultrasonics Sonochemistry
• 出版年：2017
• 出版时间：May 2017
• 年：2017
• 卷：36
• 期：Complete
• 页码：354-361
• 全文大小：4021 K
• 卷排序：36

文摘

Fine-grained 7034 alloys were successfully joined in air by ultrasonic-promoted rapid TLP bonding at only 400 °C. Ultrasonic action can promote the diffusion of Al and Zn elements. The holding time of ultrasonic-promoted TLP bonding can be shortened from 6 min to 3 min with 60 s ultrasonic time. The shear strength of joint could reach 223 MPa.