Thermal performance of phase change material (PCM) based pin-finned heat sinks for electronics devices: Effect of pin thickness and PCM volume fraction
详细信息 查看全文
- 作者：Adeel Arshad ; Hafiz Muhammad Ali ; h.m.ali@uettaxila.edu.pk ; Muzaffar Ali ; Shehryar Manzoor
- 关键词：Thermal management (TM) ; Phase change materials (PCMs) ; Thermal conductivity enhancer (TCE) ; Paraffin wax ; Heat sink
- 刊名：Applied Thermal Engineering
- 出版年：2017
- 出版时间：5 February 2017
- 年：2017
- 卷：112
- 期：Complete
- 页码：143-155
- 全文大小：4368 K
- 卷排序：112
文摘
Inclusion of paraffin wax reduces the base temperature of heat sink. An enhancement ratio of 2.64 at ψ = 1.00 is achieved for a SPT of 60 °C at 3.174 kW/m2 for 2 mm thick pin-fin heat sink. At heat input of 1.98 kW/m2, it took 145 min and 229 min to reach SPTs of 60 °C and 70 °C respectively. 3 mm Pin-fin thick heat sink outperform the 2 mm pin-fin thick heat sink for volume fractions of ψ = 0.33 and ψ = 0.66. An enhancement of 4.30 is achieved against heat flux of 3.174 kW/m2 for 2 mm thick pin-fin heat sink.