An investigation on the aggregate-shape embedded piezoelectric sensor for civil infrastructure health monitoring

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• 作者：Shanglin Song^a ; ^{630276671@qq.com} ; Yue Hou^a ; ^{alladin@outlook.com} ; Meng Guo^a ; ^{mguo@ustb.edu.cn} ; Linbing Wang^b ; ^wangl@vt.edu ; Xinlong Tong^a ; ^{630276671@qq.com} ; Jiangfeng Wu^a ; ^{630276671@qq.com}
• 关键词：Piezoelectric sensor ; Aggregate-shape ; Embedded ; Infrastructure ; Health monitoring
• 刊名：Construction and Building Materials
• 出版年：2017
• 出版时间：30 January 2017
• 年：2017
• 卷：131
• 期：Complete
• 页码：57-65
• 全文大小：3063 K
• 卷排序：131

文摘

A new piezoelectric sensor for infrastructure health monitoring is designed. 3D printing technique is used for sensor packaging. Sensor is designed in aggregate shape.