Characterization of 3D-printed microfluidic chip interconnects with integrated O-rings

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• 作者：O.H. Paydar ; C.N. Paredes ; Y. Hwang ; J. Paz ; N.B. Shah ; R.N. C ; ler
• 关键词：3D-printing ; Microfluidics ; Interconnects ; Packaging ; Polydimethylsiloxane (PDMS) ; Customizable
• 刊名：Sensors and Actuators A: Physical
• 出版年：1 January, 2014
• 年：2014
• 卷：205
• 期：Complete
• 页码：199-203
• 全文大小：1252 K

文摘

Lab-on-a-chip (LOC) devices have enabled significant advancements in medical, biological, and chemical analysis. However, widespread adoption of these devices in, clinical settings and academic environments has been impeded by a lack of a reliable, adaptable, and easy-to-use packaging technology. In this work, we introduce a rapid, prototyped modular microfluidic interconnect that addresses these challenges of the, world-to-chip interface. The interconnect, a flexible polymer gasket co-printed with, rigid clamps, eliminates adhesives and additional assembly by direct multi-material 3D, printing from a computer-aided design model. The device represents the first, application of multi-material 3D printing to microfluidic interconnects, and it can be, rapidly re-designed and printed, and has demonstrated the ability to withstand, pressures exceeding 400 kPa.