X-ray inspection of TSV defects with self-organizing map network and Otsu algorithm

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• 作者：Junjie Shen^a ; Pengfei Chen^a ; Lei Su^b ; Tielin Shi^a ; Zirong Tang^a ; Guanglan Liao^a ; ^{guanglan.liao@hust.edu.cn}
• 关键词：TSV ; Defects inspection ; X-ray ; Self-organizing map network ; Otsu algorithm
• 刊名：Microelectronics Reliability
• 出版年：2016
• 出版时间：December 2016
• 年：2016
• 卷：67
• 期：Complete
• 页码：129-134
• 全文大小：1370 K
• 卷排序：67

文摘

The SOM network can accurately distinguish normal TSVs from defective TSVs. The Otsu method is useful for locating TSV voids qualitatively. It is feasible for X-ray inspection of TSV defects with SOM and Otsu.