Low-temperature densification and excellent thermal properties of W-Cu thermal-management composites prepared from copper-coated tungsten powders

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• 作者：Lianmeng Zhang ; Wenshu Chen ; Guoqiang Luo ; Pingan Chen ; Qiang Shen ; Chuanbin Wang
• 关键词：W&ndash ; Cu composites ; Low-temperature densification ; Microstructure ; High thermal conductivity ; Low coefficient of thermal expansion
• 刊名：Journal of Alloys and Compounds
• 出版年：5 March, 2014
• 年：2014
• 卷：588
• 期：Complete
• 页码：49-52
• 全文大小：1069 K

文摘

High-density W-20 wt.%Cu composites containing a Cu-network structure and exhibiting good thermal properties were fabricated by low-temperature hot-press sintering from high-purity copper-coated tungsten powders. The relative density of W-20 wt.%Cu composites sintered at 950 掳C-100 MPa-2 h was 98.4%. The low-temperature densification of W-Cu composites occurs because the sintering mode of the coated particles involves only sintering of Cu to Cu, rather than both Cu to W and Cu to Cu, as required for conventional powder particles. The microstructure shows that a network of high-purity Cu extends throughout the composites, and that the W is distributed homogeneously; the interfaces between W and Cu show good contact. The composites have excellent thermal conductivity (239 W/(m K)) and a relatively low coefficient of thermal expansion (7.4 脳 10^鈭?/K), giving them some of the best properties reported to date for thermal-management materials. The excellent performance is mainly because of their structure, which arises from the characteristics of the high-purity copper-coated tungsten powders.