Fabrication of conductive copper patterns using reactive inkjet printing followed by two-step electroless plating

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• 作者：Jin-Ju Chen^a ; Guo-Qiang Lin^a ; Yan Wang^a ; Enrico Sowade^b ; Reinhard R. Baumann^b ; Zhe-Sheng Feng^a ; ^{fzs@uestc.edu.cn}
• 关键词：Reactive inkjet printing ; Conductive copper patterns ; Electroless plating ; Catalyst
• 刊名：Applied Surface Science
• 出版年：2017
• 出版时间：28 February 2017
• 年：2017
• 卷：396
• 期：Complete
• 页码：202-207
• 全文大小：1957 K
• 卷排序：396

文摘

Copper patterns were fabricated by reactive inkjet printing and two-step electroless plating. Cu particles produced via reactive inkjet printing act as catalyst for copper electroless plating. High conductivity can be obtained without many printing passes and high temperature sintering. This approach can largely avoid nozzle-clogging problems. This approach presents a potential way in the flexible printed electronics with simple process.