Semiconductor package qualification based on the swelling temperature

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• 作者：K.H. Song ; ^{ghsong11@ajou.ac.kr} ; J.S. Jang
• 关键词：Swelling temperature (Ts) ; Swelling ; Package ; Qualification
• 刊名：Microelectronics Reliability
• 出版年：2017
• 出版时间：February 2017
• 年：2017
• 卷：69
• 期：Complete
• 页码：71-79
• 全文大小：1451 K
• 卷排序：69

文摘

A novel reliability testing method for semiconductor packages was proposed. The swelling temperature measured at the interface between layers was measured. The swelling temperature was used as quantitative measure to analyze reliability. Statistical method for correlation analysis between Package Strength and reliability Reliability of potentially defective lots can be determined based on Ts measurements.