Dynamic thermal response characteristics and feasibility analysis of thermoelectric module in impedance measurement

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• 作者：Wei Zhu ; Yuan Deng ; ^{dengyuan@buaa.edu.cn} ; Yao Wang
• 关键词：Thermoelectric module ; Dynamic thermal response ; Impedance measurement ; Feasibility analysis ; Substrate
• 刊名：Applied Thermal Engineering
• 出版年：2017
• 出版时间：25 January 2017
• 年：2017
• 卷：111
• 期：Complete
• 页码：1417-1425
• 全文大小：2814 K
• 卷排序：111

文摘

Dynamic thermal response of TE model by loading sinusoidal currents is obtained. The feasibility and limitation in impedance measurement for TE module is evaluated. Sample size should be small to ensure the test within frequency range of equipment. The substrate lowers the measurement frequency and increases the measurement time.