Microstructure and mechanical strength of near- and sub-micrometre grain size copper prepared by spark plasma sintering

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• 作者：K.N. Zhu^a ; A. Godfrey^a ; ^{awgodfrey@mail.tsinghua.edu.cn} ; N. Hansen^b ; X.D. Zhang^b
• 关键词：Spark plasma sintering ; Copper ; Ultra-fine grain size ; Mechanical properties
• 刊名：Materials & Design
• 出版年：2017
• 出版时间：5 March 2017
• 年：2017
• 卷：117
• 期：Complete
• 页码：95-103
• 全文大小：3417 K
• 卷排序：117

文摘

Fully recrystallized Cu with near and sub-micrometre size grains have been synthesized using spark plasma sintering. A good control of grain size in the near micrometer regime is achieved by sintering and annealing. Samples of SPS Cu have a very high thermal stability and are resistant to coarsening. Transition in mechanical strength for grain sizes < 1um, with significantly enhanced strengthening in this regime.