Interfacial reaction of Ni3Sn4 intermetallic compound in Ni/SnAg solder/Ni system under thermomigration
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- 作者：Yi-Shan Yang ; Chia-Jung Yang ; Fan-Yi Ouyang ; fyouyang@ess.nthu.edu.tw" class="auth_mail" title="E-mail the corresponding author
- 关键词：Pb-free solders ; Ni3Sn4 intermetallic compound ; Metals and alloys ; Diffusion ; Liquid&ndash ; solid reactions ; Temperature gradient
- 刊名：Journal of Alloys and Compounds
- 出版年：2016
- 出版时间：25 July 2016
- 年：2016
- 卷：674
- 期：Complete
- 页码：331-340
- 全文大小：2627 K
文摘
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Interfacial reaction in Ni/SnAg solder/Ni system under thermal gradient.
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Growth rate of Ni3Sn4 at cold end is faster than that at hot end.
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Critical length-temperature gradient product at hot end is 489.2 μm°C/cm at 260 °C.
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Velocity of Ni3Sn4 moving interface is 0.134 μm/h during dynamic equilibrium.
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Molar heat of transport (Q*) of Ni in molten SnAg was +0.76 kJ/mol.