Recrystallization induced by subgrain rotation in Pb-free BGA solder joints under thermomechanical stress
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- 作者：J. Han ; hanjing@bjut.edu.cn ; F. Guo ; J.P. Liu
- 关键词：Recrystallization ; Subgrain rotation ; Grain orientation evolution ; Pb-free BGA solder joints ; EBSD
- 刊名：Journal of Alloys and Compounds
- 出版年：2017
- 出版时间：25 March 2017
- 年：2017
- 卷：698
- 期：Complete
- 页码：706-713
- 全文大小：2652 K
- 卷排序：698
文摘
Further polishing of cross-sections was avoided after thermal shock. As-reflowed tricrystal joints often appear to be composed of two grains. Recrystallization occurred in strain concentration region by subgrain rotation. Recrystallization in solder joints was facilitated by the anisotropy of tin. Activated slip systems can be used to predict subgrain boundary formation.