Full densification of inkjet-printed copper conductive tracks on a flexible substrate utilizing a hydrogen plasma sintering

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• 作者：Young-Tae Kwon^a ; Young-In Lee^b ; Seil Kim^a ; Kun-Jae Lee^c ; Yong-Ho Choa^a ; ^{choa15@hanyang.ac.kr}
• 关键词：Inkjet printing ; Copper conductive tracks ; Full densification ; Plasma sintering ; Flexible substrates
• 刊名：Applied Surface Science
• 出版年：2017
• 出版时间：28 February 2017
• 年：2017
• 卷：396
• 期：Complete
• 页码：1239-1244
• 全文大小：3688 K
• 卷排序：396

文摘

Hydrogen thermally- and plasma- treatments are applied to reduce and sinter the inkjet-printed copper patterns at low temperature. Plasma sintered Cu patterns have fully densified microstructure with the resistivity of 3.23 μW cm. Cu conductive track with dense microstructure remains its electrical resistivity after 1 month. Thermal sintered Cu patterns show a relatively poor microstructure and high resistivity.