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High-energy ion implantation of iron in silicon
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文摘
Seventy MeV, 56Fe5+ ion implantation into p-type silicon with different doses varying from 1×1012 to 5×1014 ionscm−2 has been investigated by Fourier transform infrared (FT/IR) reflectivity and low temperature (298–133 K) ESR measurements. The FT/IR reflectivity studies showed the presence of interference fringes in high dose (>1×1013 ionscm−2) implanted samples indicating the formation of ion induced damaged layers. The depth of the damaged layer from the silicon surface estimated from fringe shifts was found to be about 16 μm comparable to the project range of 56Fe ions in silicon at 70 MeV. The ESR studies show the presence of Pa and Pb centers with g values 2.0063 and 2.0015, respectively, at room temperature. In addition to these, other defects observed at g values 2.0071 and 1.9947 are due to complex defects produced by high-energy ion implantation.

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