High thermal stable thermoplastic–thermosetting polyimide film by use of asymmetric dianhydride (a-BPDA)

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• 作者：Takeshi Sasaki ; Hiroyuki Moriuchi ; Shoichiro Yano and Rikio Yokota
• 关键词：Asymmetric 2 ; 3 ; 3′ ; 4′ ; -biphenyltetracarboxylic dianhydride (a-BPDA) ; Thermoplastics– ; thermosetting polyimide ; Pendent phenylethynyl group
• 刊名：Polymer
• 出版年：2005
• 出版时间：2005
• 年：2005
• 卷：46
• 期：18
• 页码：6968-6975
• 全文大小：629 K

文摘

In order to obtain thermoplastic (before curing) and thermosetting (after curing) polyimides with high T_g for adhesive film, we prepared novel polyimides having phenylethynyl group in the side chain (44 % of concentration of curing group) from asymmetric 2,3,3′,4′-biphenyltetracarboxylic dianhydride (a-BPDA), 3,4′-oxydianiline (3,4′-ODA) or 1,3-bis(4-aminophenoxy)benzene (1,3,4-APB) or 1,3-bis(3-aminophenoxy)benzene (1,3,3-APB), and 2,4-diamino-1-(4-phenylethynylphenoxy)benzene (mPDAp). Among three kinds of polymer, uncured polyimide of a-BPDA/1,3,4-APB; mPDAp had rather high T_g (265 °C, DMA) and thermoplasticity (E′ drop>10³ at T_g). After curing reaction of phenylethynyl group, the T_g of the polyimide was increased dramatically (364 °C, DMA). The polyimide derived from 1,3,4-APB having less concentration of curing group (20 % ) was also prepared to improve further film flexibility and toughness.