Separating HBT wearout from defects during early life operation

详细信息    查看全文

• 作者：William J. Roesch ; Philip Rains
• 刊名：Microelectronics Reliability
• 出版年：February, 2014
• 年：2014
• 卷：54
• 期：2
• 页码：360-365
• 全文大小：1551 K

文摘

This is a paper that bridges the gap between quality and reliability. It is focused specifically on early life failures - the ones that customers actually experience. Progress on identifying, duplicating, and predicting early failures is necessary to remove defects and improve reliability for semiconductor products. This work relies on the notion that quality is an integral part of device reliability and the results shown here reinforce the existence of quality-to-reliability correlations for certain failure mechanisms. This work advances the knowledge of reliability by showing the importance of the relationship between quality and reliability to draw the focus back to what really matters for customers... reduced defects and lower early fallout.