Electromigration of Sn–3Ag–0.5Cu and Sn–3Ag–0.5Cu–0.5Ce–0.2Zn solder joints with Au/Ni(P)/Cu and Ag/Cu pads

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• 作者：Hsiu-Jen Lin ; Jian-Shian Lin ; Tung-Han Chuang
• 关键词：Electromigration ; Sn&#x2013 ; 3Ag&#x2013 ; 0.5Cu ; Sn&#x2013 ; 3Ag&#x2013 ; 0.5Cu&#x2013 ; 0.5Ce&#x2013 ; 0.2Zn ; Au/Ni(P)/Cu pad ; Ag/Cu pad
• 刊名：Journal of Alloys and Compounds
• 出版年：2009
• 出版时间：13 November 2009
• 年：2009
• 卷：487
• 期：1-2
• 页码：458-465
• 全文大小：2711 K

文摘

It has previously been established that adding 0.2 wt. % Zn into a Sn–3Ag–0.5Cu–0.5Ce alloy improves the mechanical properties and eliminates the problem of rapid whisker growth. However, no detailed studies have been conducted on electromigration behavior of Sn–3Ag–0.5Cu–0.5Ce–0.2Zn alloy. The electromigration damage in solder joints of Sn–3Ag–0.5Cu and Sn–3Ag–0.5Cu–0.5Ce–0.2Zn with Ag/Cu pads and Au/Ni(P)/Cu pads was studied after current stressing at room temperature with an average current density of 3.1 × 10⁴ A/cm². With additions of 0.5 wt. % Ce and 0.2 wt. % Zn, the electromigration processes of Sn–Ag–Cu solder joints were accelerated due to refinement of the solder matrix when joint temperature was around 80 °C. Since Ni is more resistant than Cu to diffusion driven by electron flow, solder joints of both alloys (Sn–3Ag–0.5Cu and Sn–3Ag–0.5Cu–0.5Ce–0.2Zn) with Au/Ni(P)/Cu pads possess longer current-stressing lifetimes than those with Ag/Cu pads.