Characterization of phase change material systems using a thermal test device

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• 作者：Xavier Jordà ; ^a ; ^{xavier.jorda@imb-cnm.csic.es" class="auth_mail" title="E-mail the corresponding author} ; Jesú ; s Esarte^b ; Xavier Perpi&ntilde ; à ; ^a ; Miquel Vellvehi^a ; Gorka Argando&ntilde ; a^b ; Maite Aresti^b
• 关键词：Thermal characterization ; Phase change materials ; Thermal management ; Thermal test devices
• 刊名：Microelectronics Journal
• 出版年：2015
• 出版时间：December 2015
• 年：2015
• 卷：46
• 期：12
• 页码：1195-1201
• 全文大小：4589 K

文摘

This work presents a thermal characterization approach for phase change materials thermal management systems (PCM-TMS) based on a thermal test device (TTD) allowing simultaneous dissipation and chip temperature measurement. The tests are oriented towards PCM-TMS characterization for their application in the power electronics domain, providing an insight to the physical phenomena involved in PCM systems. The PCM-TMS used in this work consists in a 35 mm diameter and 9.5 mm height Cu case, containing a 20 ppi porous Cu mesh and a 31 °C melting temperature paraffin. It has been demonstrated that the proposed characterization methodology is suitable for the assessment of this kind of non-linear systems, allowing an easy acquisition of both, heating and cooling transients.