Bayesian analysis of low-cycle fatigue failure in printed wiring boards

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• 作者：Rong Pan^a ; ^{rong.pan@asu.edu} ; Xinyue Xu^a ; Joseph Juarez^b
• 关键词：Reliability ; Circuit board ; Thermal cycling test ; Weibull regression ; Bayesian analysis
• 刊名：Case Studies in Engineering Failure Analysis
• 出版年：2016
• 出版时间：October 2016
• 年：2016
• 卷：7
• 期：Complete
• 页码：65-70
• 全文大小：508 K
• 卷排序：7

文摘

Accelerated life tests of PWBs were conducted. Failure data were analyzed by fitting Weibull regression models. Bayesian data analysis was performed. The lifetime prediction formula for the fatigue life of PWB was derived.