Interfacial microstructure and mechanical characterization of silicon nitride/nickel-base superalloy joints by partial transient liquid phase bonding

详细信息    查看全文

• 作者：Liang Lan^a ; Jianbo Yu^a ; Zhigang Yang^a ; Chuanjun Li^a ; Zhongming Ren^a ; ^{renzm2201@163.com" class="auth_mail" title="E-mail the corresponding author} ; Qiuliang Wang^b
• 关键词：B. Interfaces ; C. Mechanical properties ; Silicon nitride ; Microstructure
• 刊名：Ceramics International
• 出版年：2016
• 出版时间：January 2016
• 年：2016
• 卷：42
• 期：1
• 页码：1633-1639
• 全文大小：2373 K

文摘

Si₃N₄ ceramic has been joined successfully to nickel-based superalloy by partial transient liquid phase (PTLP) bonding using Ni/Cu/Ti multi-interlayers. The interfacial microstructure and strength of the joints were investigated by scanning electron microscopy (SEM), transmission electron microscopy (TEM) and a three-point bending test. According to the TEM analysis, it was found that a TiN reaction layer was formed at the Si₃N₄/filler alloy interface. The TiN reaction layer was composed of two zones: one next to the Si₃N₄ ceramic with a thickness of about 0.4 μm and the other zone with grains of about 0.8 μm. The microstructure of the joint between the Si₃N₄ and the Cu interlayer can be described as: TiN layer with fine grains/TiN layer with coarse grains/Ti₂Ni layer. Ni₃Ti and CuTi₂ phases were produced at the interface between the Cu interlayer and the DZ483 superalloy. The room-temperature average strength of the joint was 147 MPa, and 96 MPa was achieved when the joints were tested at 1073 K.