Tangential cathode magnetic field and substrate bias influence on copper vacuum arc macroparticle content decreasing

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• 作者：Igor B. Stepanov ; ^{stepanovib@tpu.ru" class="auth_mail" title="E-mail the corresponding author} ; Alexander I. Ryabchikov ; Peter S. Ananin ; Denis O. Sivin ; Alexey E. Shevelev ; Sergei G. Zhelomsky
• 关键词：Vacuum-arc plasma ; Macroparticles ; High-frequency short-pulse negative bias potential ; Steered arc
• 刊名：Surface and Coatings Technology
• 出版年：2016
• 出版时间：25 November 2016
• 年：2016
• 卷：306
• 期：part_PA
• 页码：21-24
• 全文大小：661 K

文摘

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d="p0005">Cu vacuum-arc macroparticles accumulation on substrate was investigated.

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d="p0010">The influence of normal and tangential to cathode magnetic fields was studied.

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d="p0015">The multifold effect of copper macroparticle suppression on biased substrate was shown.

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d="p0020">Applying short-pulsed bias leads to a 250-fold decrease in total macroparticle number.

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