Thermally Stable Siloxane Hybrid Matrix with Low Dielectric Loss for Copper-Clad Laminates for High-Frequency Applications
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- 作者：Yong Ho Kim ; Young-Woo Lim ; Yun Hyeok Kim ; Byeong-Soo Bae
- 刊名：ACS Applied Materials & Interfaces
- 出版年：2016
- 出版时间：April 6, 2016
- 年：2016
- 卷：8
- 期：13
- 页码：8335-8340
- 全文大小：398K
- ISSN：1944-8252
文摘
We report vinyl-phenyl siloxane hybrid material (VPH) that can be used as a matrix for copper-clad laminates (CCLs) for high-frequency applications. The CCLs, with a VPH matrix fabricated via radical polymerization of resin blend consisting of sol–gel-derived linear vinyl oligosiloxane and bulky siloxane monomer, phenyltris(trimethylsiloxy)silane, achieve low dielectric constant (Dk) and dissipation factor (Df). The CCLs with the VPH matrix exhibit excellent dielectric performance (Dk = 2.75, Df = 0.0015 at 1 GHz) with stability in wide frequency range (1 MHz to 10 GHz) and at high temperature (up to 275 °C). Also, the VPH shows good flame resistance without any additives. These results suggest the potential of the VPH for use in high-speed IC boards.