On the Influence of Surfactant Incorporation during Electroless Nickel Plating

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• 作者：Nkem Nwosu ; Alan Davidson ; Colin Hindle ; Mike Barker
• 刊名：Industrial & Engineering Chemistry Research
• 出版年：2012
• 出版时间：April 25, 2012
• 年：2012
• 卷：51
• 期：16
• 页码：5635-5644
• 全文大小：339K
• 年卷期：v.51,no.16(April 25, 2012)
• ISSN：1520-5045

文摘

The effects of surfactants on the dynamics and characteristics of plain and composite electroless nickel plating (ENP) are highlighted and discussed herein. An outline of the rudiments of surfactants and some underlying selection criteria is presented at the outset, before emphasis is laid on the salient benefits of introducing such external agents during the plating process. Evidence suggests that their influence on key coating characteristics such as the rate of deposition, structure, corrosion resistance, and the degree of second-phase particle incorporation into the nickel matrix is significant, and depending on the nature and concentration of surfactant employed, can be of immense value to the system.