Dendritic Growth and Morphology Selection in Copper Electrodeposition from Acidic Sulfate Solutions Containing Chlorides
详细信息 查看全文
- 作者：Wenbo Shao ; Giovanni Zangari
- 刊名：Journal of Physical Chemistry C
- 出版年：2009
- 出版时间：June 11, 2009
- 年：2009
- 卷：113
- 期：23
- 页码：10097-10102
- 全文大小：272K
- 年卷期：v.113,no.23(June 11, 2009)
- ISSN：1932-7455
文摘
We investigate the morphology of Cu films electrodeposited onto silicon from an acidic sulfate electrolyte with the addition of a variable concentration of chloride anions. Addition of chloride increases grain size and the degree of grain faceting while decreasing the density of growth nuclei. Well-developed monocrystalline dendrites are formed in acidic sulfate solutions with high concentration of chloride. Dendrites form under growth conditions that either approach diffusion limitation, or occur within a potential range where different crystallographic faces exhibit a different potential dependence for chloride desorption. The presence of dendrites however is mainly related to the fact that the reduction route Cu2+ → CuCl → Cu becomes the rate-determining process in solutions with high chloride concentration; the rate of this reaction is largest at {110} planes, where the concentration of chloride anions is the highest, generating dendrites with branches along the {110} directions.