In this work we demonstrate two building blocks of a scalable manufacturing technology for nanoscale electronic devices based on direct-write printing: an architecture for high-yield printing of electrode gaps with 100 nm dimension and a low-temperature silver complex ink for integration of organic materials with high conductivity metal interconnects. We use single printed droplets that are made to dewet slowly from each other to allow reliable, high yield patterning even in the presence of certain surface defects.