Interfacial Reactions in the Ni/Sn-xZn/Cu Sandwich Couples

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• 作者：Yee-Wen Yen ; Chung-Yung Lin ; Mei-Ting Lai…
• 关键词：Interfacial reactions ; Ni/Sn ; xZn/Cu sandwich couples ; intermetallic compound
• 刊名：Journal of Electronic Materials
• 出版年：2016
• 出版时间：January 2016
• 年：2016
• 卷：45
• 期：1
• 页码：203-211
• 全文大小：2,019 KB
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• 作者单位：Yee-Wen Yen (1)
  Chung-Yung Lin (2)
  Mei-Ting Lai (1)
  Wan-Ching Chen (1)
  
  1. Department of Materials Science and Engineering, National Taiwan University of Science and Technology, Taipei, 106, Taiwan, Roc
  2. Chemical Engineering Division, Institute of Nuclear Energy Research, Taoyuan, 32546, Taiwan, Roc
  
• 刊物类别：Chemistry and Materials Science
• 刊物主题：Chemistry
  Optical and Electronic Materials
  Characterization and Evaluation Materials
  Electronics, Microelectronics and Instrumentation
  Solid State Physics and Spectroscopy
  
• 出版者：Springer Boston
• ISSN：1543-186X

文摘

The interfacial reactions in Ni/Sn-xZn/Cu sandwich couples which were reflowed at 270°C for 1 h and then aged at 160°C for 1–1000 h were investigated. When the 1000-μm-thick Sn-Zn alloy reacted with Ni and Cu in this couple, the results indicated that the (Ni, Cu)₃Sn₄, (Ni, Cu)₅Zn₂₁, and Ni₅Zn₂₁ phases were formed at Sn-1Zn/Ni, Sn-5Zn/Ni, and Sn-9Zn/Ni interfaces for 1 h reflowing, respectively. After 1000 h aging, each intermetallic compound (IMC) was converted to (Cu, Ni, Zn)₆Sn₅, (Ni, Cu, Sn)₅Zn₂₁/Ni₅Zn₂₁, and Ni₅Zn₂₁ (two layers) phases in the related couples. On the Cu side, the Cu₆Sn₅ phase in the Sn-1Zn/Cu interface and the Cu₅Zn₈ phase in the Sn-5Zn/Cu and Sn-9Zn/Cu interfaces were observed when the couple was reflowed at 270°C for 1 h. After 100 h aging, the (Cu, Ni, Zn)₆Sn₅, Cu₅Zn₈/(Cu, Zn)₆Sn₅, and Cu₅Zn₈ phases were formed at the Sn-1Zn/Cu, Sn-5Zn/Cu and Sn-9Zn/Cu interfaces. When the Sn-Zn alloy thickness was decreased to 500 μm, the (Cu, Ni, Zn)₆Sn₅ phase at the Sn-1Zn/Ni interface and the (Ni, Cu, Sn)₅Zn₂₁ phase at the Sn-5Zn/Ni and Sn-9Zn/Ni interfaces were observed after 1 h reflowing. When the couple was aged at 160°C for 1000 h, each IMC was converted to (Cu, Ni, Zn)₆Sn₅ and Cu₅Zn₈/(Cu, Ni, Sn)Zn/Ni₅Zn₂₁ phases at the Sn-1Zn/Ni and Sn-(5, 9)Zn/Ni interfaces. (Cu, Ni, Zn)₆Sn₅ and Cu₅Zn₈ were, respectively, formed at the Sn-1Zn/Cu and Sn-(5, 9)Zn/Cu interfaces for 1 h reflowing. After 100 h aging, the IMCs were converted to (Cu, Ni, Zn)₆Sn₅ and Cu₅Zn₈/(Cu, Zn)₆Sn₅ phases. This current study reveals that the IMC formation in Ni/(Sn-xZn)/Cu sandwich couples are very sensitive to the Zn concentration and thickness in Sn-xZn alloys.