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Evaluation of cooling performance of impinging jet array over various dimpled surfaces
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  • 作者:Sun-Min Kim ; Kwang-Yong Kim
  • 刊名:Heat and Mass Transfer
  • 出版年:2016
  • 出版时间:April 2016
  • 年:2016
  • 卷:52
  • 期:4
  • 页码:845-854
  • 全文大小:2,561 KB
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  • 作者单位:Sun-Min Kim (1)
    Kwang-Yong Kim (1)

    1. Department of Mechanical Engineering, Inha University, 253 Yonghyun-Dong, Nam-Gu, Incheon, 402-751, Republic of Korea
  • 刊物类别:Engineering
  • 刊物主题:Engineering Thermodynamics and Transport Phenomena
    Industrial Chemistry and Chemical Engineering
    Thermodynamics
    Physics and Applied Physics in Engineering
    Theoretical and Applied Mechanics
    Engineering Fluid Dynamics
  • 出版者:Springer Berlin / Heidelberg
  • ISSN:1432-1181
文摘
Various configurations of an impinging jet–dimple array cooling system were evaluated in terms of their heat transfer and pressure drop performances. The steady incompressible laminar flow and heat transfer in the cooling system were analyzed using three-dimensional Navier–Stokes equations. The obtained numerical results were validated by a comparison with experimental data for the local Nusselt number distribution. The area-averaged Nusselt number on the projected area and the pressure drop through the system were selected as the performance parameters. Among the four tested configurations—inline concave, staggered concave, inline convex, and staggered convex—the staggered convex impinging jet–dimple array showed the best heat transfer performance whereas the staggered-concave configuration showed the lowest pressure drop. A parametric study with two geometric variables, i.e., the height of dimple and the diameter of dimple, was also conducted for the staggered-convex impinging jet–dimple array. As a result, the best heat transfer and pressure drop performances were achieved when the ratio of the height of dimple to the diameter of jet was 0.8. And, the increase in the ratio of the diameter of dimple to the diameter of jet yielded monotonous increase in the heat transfer performance.

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