Enhanced boiling performance of a nanoporous copper surface by electrodeposition and heat treatment

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• 作者：Jiao Gao ; Long-Sheng Lu ; Jia-Wei Sun ; Xiao-Kang Liu ; Biao Tang
• 刊名：Heat and Mass Transfer
• 出版年：2017
• 出版时间：March 2017
• 年：2017
• 卷：53
• 期：3
• 页码：947-958
• 全文大小：
• 刊物类别：Engineering
• 刊物主题：Engineering Thermodynamics, Heat and Mass Transfer; Industrial Chemistry/Chemical Engineering; Thermodynamics;
• 出版者：Springer Berlin Heidelberg
• ISSN：1432-1181
• 卷排序：53

文摘

A nanoporous structure was fabricated on the surface of a copper block by electrodeposition and heat treatment compound technology. The influence of the heat treatment parameters on the binding force of a structure was analyzed, and a platform was set up to test the pool boiling heat transfer performance. By observing the SEM morphology, the effect of electrodeposition parameters on the formation of nanoporous structure was determined, and the heat transfer coefficient and wall superheat between different surfaces were compared. At the same time, by means of visualization, the bubble behavior of a smooth surface and a nanoporous surface under different heat fluxes was studied. The results show that the surface structure of nanoporous copper prepared by electrodeposition and heat treatment can improve the bonding strength by 77 %, decrease the wall superheat by 45 %, and increase the heat transfer coefficient by 80 %.