Engineering functionalized PS/mSiO₂ composite particles with controlled meso-shell thickness for chemical mechanical planarization applications

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• 作者：Ailian Chen ; Jiawei Qin ; Zefeng Li…
• 刊名：Journal of Materials Science: Materials in Electronics
• 出版年：2017
• 出版时间：January 2017
• 年：2017
• 卷：28
• 期：1
• 页码：284-288
• 全文大小：
• 刊物类别：Chemistry and Materials Science
• 刊物主题：Optical and Electronic Materials; Characterization and Evaluation of Materials;
• 出版者：Springer US
• ISSN：1573-482X
• 卷排序：28

文摘

The functionalized PS/mSiO₂ composite particles (CPs), featuring polystyrene cores and mesoporous silica shells, were introduced into chemical mechanical planarization (CMP) processes. The PS/mSiO₂ CPs presented a higher material removal rate (MRR) and a lower root-mean-square (RMS) roughness than conventional solid silica particles. The MRR (48–75 nm/min) and RMS roughness (0.16–0.26 nm) of the finished oxidized silicon wafers decreased as the shell thickness (30–50 nm) reduced. The reduced RMS roughness was attributed to their relatively low hardness and modulus. The enhanced MRR resulted from their strong adsorptivity for the active components in slurries. The non-damage surfaces were efficiently achieved from the synergetic effect of the non-rigid mechanical properties and the enhanced chemical reactivity in the interfaces between PS/mSiO₂ CPs and substrates.