Comparisons of thermal conductive behaviors of epoxy resin in unidirectional composite materials

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• 作者：Kai Dong ; Bohong Gu ; Baozhong Sun
• 关键词：Thermal conductive behaviors ; Temperature distribution ; Unidirectional (UD) lamina ; Finite element method (FEM)
• 刊名：Journal of Thermal Analysis and Calorimetry
• 出版年：2016
• 出版时间：May 2016
• 年：2016
• 卷：124
• 期：2
• 页码：775-789
• 全文大小：3,599 KB
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• 作者单位：Kai Dong (1)
  Bohong Gu (1)
  Baozhong Sun (1)
  
  1. College of Textiles, Key Laboratory of High Performance Fibers & Products, Ministry of Education, Donghua University, Shanghai, China
  
• 刊物类别：Chemistry and Materials Science
• 刊物主题：Chemistry
  Sciences
  Polymer Sciences
  Physical Chemistry
  Inorganic Chemistry
  Measurement Science and Instrumentation
  
• 出版者：Akad茅miai Kiad贸, co-published with Springer Science+Business Media B.V., Formerly Kluwer Academic
• ISSN：1572-8943

文摘

This paper reports thermal conductive behaviors of three kinds of materials, i.e., epoxy resin bar, carbon fiber bundles/epoxy system, and unidirectional carbon fiber/epoxy lamina along 0° and 90° directions. The apparatus for thermal conduction measurement was manufactured and calibrated with an aluminum bar with known thermal conductivity. The thermal conductive behaviors, including the thermal conductive rate and thermal equilibrium time, were tested and numerically simulated with finite element method. It is found that these materials have similar thermal conductive characteristics with same trends of temperature–time curves and thermal gradient–time curves. In addition, with the increase in fiber volume content or decrease in fiber orientation angle, the thermal conductive rate will be speeded up and thermal equilibrium time will be reduced. The temperature of epoxy resin in composite will increase with the increment of fiber volume content. Due to the existence of interface between fiber and resin, the overall thermal conductive ability of composite will be weakened. Owing to the epoxy resin, carbon fiber bundles/epoxy system and unidirectional carbon fiber/epoxy lamina are the basic materials for the laminates or complex preform reinforced composites, and the thermal conductive behaviors of these basic materials could be extended to design the thermal conductive behaviors of laminates and complex reinforcement composite materials.