Light welding nanoparticles: from metal colloids to free-standing conductive metallic nanoparticle film

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• 作者：Fei Chen 陈菲 ; Shuzhen Yang 杨抒臻 ; Zhenjun Wu 吴振军 ; Wei Hu 胡伟…
• 关键词：interfacial self ; assembly ; nanoparticle ; light welding ; conductive metallic film ; photodetector
• 刊名：Science China Materials
• 出版年：2017
• 出版时间：January 2017
• 年：2017
• 卷：60
• 期：1
• 页码：39-48
• 全文大小：4768KB
• 刊物类别：Materials Science, general; Chemistry/Food Science, general;
• 刊物主题：Materials Science, general; Chemistry/Food Science, general;
• 出版者：Science China Press
• ISSN：2199-4501
• 卷排序：60

文摘

Bottom-up assembly of nanostructured thin films could offer an alternative low-cost approach to electronic thin films. However, such solution-processed thin films are often plagued by excessive inter-particle resistance and only exhibit limited current delivering capability. Here, we report a novel approach to fabricate highly conductive free-standing metallic thin film, accomplished by combining interfacial self-assembly of nanoparticles (NPs) and a light welding process. We found that light from a xenon lamp can weld adjacent Ag and Au NPs assembled at the water-air interface, forming a highly interconnected, free-standing metallic thin film structure with excellent electrical transport properties. With such a unique structure, the resultant thin metallic films show not only high flexibility and robustness, but also high conductivity comparable to bulk metallic thin films. Our studies offer a low-cost, room-temperature, and solution-processable approach to highly conductive metallic films. It can significantly impact solution-processable electronic and optoelectronic devices.