In-Situ Measurements of Free-Standing, Ultra-Thin Film Cracking in Bending

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• 作者：E. Hintsala ; D. Kiener ; J. Jackson ; W. W. Gerberich
• 关键词：Electron backscatter diffraction ; Fracture testing ; Electron micrscopy ; Steel ; Nanomechanics
• 刊名：Experimental Mechanics
• 出版年：2015
• 出版时间：November 2015
• 年：2015
• 卷：55
• 期：9
• 页码：1681-1690
• 全文大小：4,944 KB
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• 作者单位：E. Hintsala (1)
  D. Kiener (2)
  J. Jackson (3)
  W. W. Gerberich (1)
  
  1. Department of Chemical Engineering and Materials Science, University of Minnesota, Amundson Hall, 421 Washington Avenue SE, Minneapolis, MN, 55455, USA
  2. Department of Materials Physics, Montanuniversit盲t Leoben, Leoben, Austria
  3. Idaho National Laboratory, Idaho Falls, ID, USA
  
• 刊物类别：Engineering
• 刊物主题：Mechanical Engineering
  Theoretical and Applied Mechanics
  Characterization and Evaluation Materials
  Structural Mechanics
  Engineering Fluid Dynamics
  Engineering Design
  
• 出版者：Springer Boston
• ISSN：1741-2765

文摘

Metallic thin films are widely used and relied upon for various technologies. Direct measurements of fracture toughness are rare for metallic thin films and existing methods for obtaining these measurements often do not provide characterization of the cracking process for determination of crack growth mechanisms. To rectify this, we explore a new technique which utilizes doubly clamped, in-situ three-point bend testing of micro-scale and nano-scale specimens. This is done by in-situ scanning electron microscopy (SEM) and transmission electron microscopy (TEM) mechanical testing for specimens with thicknesses of 2500 nm (SEM), 500 nm (SEM) and 100 nm (TEM). For in-situ TEM, a novel notching method is employed using the converged electron beam which achieves a notch radius of approximately 5 nm. Additionally, we present supporting characterization using Electron Backscatter Diffraction (EBSD) for 2500 nm thick specimens as a demonstration of the potential of this technique for understanding local deformation. Analysis of the acquired data presents several issues that require addressing, and recommendations for future improvements are given. Keywords Electron backscatter diffraction Fracture testing Electron micrscopy Steel Nanomechanics