A Study on the Nanofiber-Sheet Anisotropic Conductive Films (NS-ACFs) for Ultra-Fine-Pitch Interconnection Applications

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• 作者：Sang-Hoon Lee ; Kyung-Wook Paik
• 关键词：Nanofiber ; sheet (NS) ; nanofiber ; electrospinning ; anisotropic conductive films (ACFs) ; ultra ; fine ; pitch interconnection ; plasma etching
• 刊名：Journal of Electronic Materials
• 出版年：2017
• 出版时间：January 2017
• 年：2017
• 卷：46
• 期：1
• 页码：167-174
• 全文大小：
• 刊物类别：Chemistry and Materials Science
• 刊物主题：Optical and Electronic Materials; Characterization and Evaluation of Materials; Electronics and Microelectronics, Instrumentation; Solid State Physics;
• 出版者：Springer US
• ISSN：1543-186X
• 卷排序：46

文摘

Nanofiber-sheet anisotropic conductive films (NS-ACFs) were invented to overcome the limitations of high joint resistance and short-circuit issues of ultra-fine-pitch interconnections. The NS-ACFs have great advantages in terms of suppressing conductive particle movement during the flip-chip bonding process. In a 20-μm ultra-fine-pitch with 7-μm bump spacing ultra-fine-pitch chip-on-glass assembly, suppression effects of conductive particle movement were significantly improved by using the NS-ACFs because an unmelted NS inside the ACFs suppressed the mobility of conductive particles so that they would not flow out during the bonding process. The NS-ACFs could significantly increase the capture rate of conductive particles from 31% up to 81% compared to conventional ACFs. Moreover, excellent electrical contact properties were obtained without melting the nanofiber material which was essential for the conventional nanofiber ACFs. The NS-ACFs are promising interconnection materials for ultra-fine-pitch packaging applications.