Variable Temperature Blackbodies via Variable Conductance: Thermal Design, Modelling and Testing

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• 作者：N. Melzack ; E. Jones ; D. M. Peters ; J. G. Hurley…
• 关键词：Blackbody ; Calibration ; Thermal design ; Variable thermal conductance
• 刊名：International Journal of Thermophysics
• 出版年：2017
• 出版时间：February 2017
• 年：2017
• 卷：38
• 期：2
• 全文大小：
• 刊物类别：Physics and Astronomy
• 刊物主题：Condensed Matter Physics; Classical Mechanics; Industrial Chemistry/Chemical Engineering; Physical Chemistry;
• 出版者：Springer US
• ISSN：1572-9567
• 卷排序：38

文摘

This paper presents the overall design for large (\(\sim \)400 mm aperture) reference blackbody cavities currently under development at the Science and Technology Facilities Council Rutherford Appleton Laboratory Space Department (STFC RAL Space), in collaboration with the National Physical Laboratory (NPL). These blackbodies are designed to operate in vacuum over a temperature range from 160 K to 370 K, with an additional capability to operate at \(\sim \)100 K as a point of near-zero radiance. This is a challenging problem for a single blackbody. The novel thermal design presented in this paper enables one target that can physically achieve and operate successfully at both thermal extremes, whilst also meeting stringent temperature gradient requirements. The overall blackbody design is based upon a helium gas-gap heat switch and modified to allow for variable thermal conductance. The blackbody design consists of three main concentric cylinder components—an inner cavity (aluminium alloy), a radiation shield (aluminium) and an outer liquid nitrogen (\(\hbox {LN}_{2}\)) jacket (stainless steel). The internal surface of the cavity is the effective radiating surface. There is a helium gas interspace surrounding the radiation shield and enclosed by the \(\hbox {LN}_{2}\) jacket and the inner cavity. The blackbodies are now at a mature stage of development. In this paper, the overall design, focusing upon the thermal design solution, is detailed. This paper will also concern the full-scale prototype breadboard model, for which results on thermal stability, spatial gradients and other sensitivities will be presented.