Frustum pyramid shape of indium bump to lengthen cycling life of InSb infrared detector

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• 作者：Xiaoling Zhang ; Yanping Gao ; Qingduan Meng ; Yanqiu Lv…
• 关键词：InSb ; Infrared focal plane arrays ; Thermal deformation ; Indium frustum pyramid
• 刊名：Optical and Quantum Electronics
• 出版年：2017
• 出版时间：February 2017
• 年：2017
• 卷：49
• 期：2
• 全文大小：
• 刊物主题：Optics, Lasers, Photonics, Optical Devices; Electrical Engineering; Characterization and Evaluation of Materials; Computer Communication Networks;
• 出版者：Springer US
• ISSN：1572-817X
• 卷排序：49

文摘

The thermal deformation appearing in indium antimonide infrared focal plane arrays (InSb IRFPAs) subjected to thermal shock tests, will easily incur the fracture of InSb chip, this phenomenon restricts the final yield of InSb IRFPAs. In light of the proposed equivalent method, the three dimensional structural modeling of InSb IRFPAs is developed, and the simulated strain distributions are consistent with the buckling pattern, the shallow groove and the local flatness, appearing on the top surface of InSb IRFPAs at the corresponding regions. After comparing the deformation profiles at different regions, we deduce that the top surface flatness of InSb IRFPAs will be improved with frustum pyramid indium bump arrays, and this deduction is verified by the subsequent simulation results. That is, when the top surface area of indium bump is smaller than its bottom surface area, in this paper, the diameter of indium bump bottom surface is set with 24 μm, the simulated Z-components of strain is uniformly covering the whole top surface of InSb IRFPAs, and the deformation amplitude is decreased slowly with the decreasing top surface area of indium frustum pyramid arrays. These findings are beneficial to further improve the flatness of InSb IRFPAs, correspondingly, to lengthen its temperature cycling life.