A Study on the Effects Bonding Temperature and Holding Time on Mechanical and Metallurgical Properties of Al–Cu Dissimilar Joining by DFW

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• 作者：Ahmad Safarzadeh ; Moslem Paidar…
• 关键词：Bonding temperature ; Diffusion welding ; Holding time ; Shear strength
• 刊名：Transactions of the Indian Institute of Metals
• 出版年：2017
• 出版时间：January 2017
• 年：2017
• 卷：70
• 期：1
• 页码：125-131
• 全文大小：
• 刊物类别：Chemistry and Materials Science
• 刊物主题：Metallic Materials; Materials Science, general; Tribology, Corrosion and Coatings;
• 出版者：Springer India
• ISSN：0975-1645
• 卷排序：70

文摘

The aim of this study was to evaluate the influence of bonding temperature and holding time on the metallurgical and mechanical properties for weld joints of 5 mm aluminum to copper using Sn interlayer. The bonding temperature varied from 500 to 600 °C whilst the holding time varied from 30 to 120 min under 8 MPa uniaxial load in 1 × 10−4 torr vacuum. The microstructure analysis, phase analysis and distribution of elements in the interface were performed by scanning electron microscopy, energy-dispersive X-ray spectroscopy, and element map analysis. It was found that diffusion welding parameters had a significant effect on shear strength. The attained data of tensile strength tests showed that the shear strength increased with increasing bonding temperature and holding time, although in 120 min, the holding time had a bilateral effect on the shear strength and shear strength dropped marginally as holding time increased. The highest shear strength value was 110 MPa which was obtained for the samples joined for 60 min holding time and 600 °C bonding temperature. Further, the results showed that parameters had significant effect on the thickness of reaction layers.