Surface Degradation of Ag/W Circuit Breaker Contacts During Standardized UL Testing
详细信息 查看全文
- 作者：Haibo Yu ; Yu Sun ; M. Tumerkan Kesim…
- 关键词：circuit breaker contacts ; contact resistance ; electron microscopy ; UL testing
- 刊名：Journal of Materials Engineering and Performance
- 出版年：2015
- 出版时间：September 2015
- 年：2015
- 卷：24
- 期：9
- 页码：3251-3262
- 全文大小：3,366 KB
- 参考文献：1.P.V. Minakova, M.L. Grekova, A.P. Kresanov, and L.A. Kryachko, Composites for Contacts and Electrodes (A Review), Powder Metall. Met. Ceram., 1995, 34(7-8), p 370鈥?85CrossRef
2.P.G. Slade, Variations in Contact Resistance Resulting from Oxide Formation and Decomposition in Ag-W and Ag-WC-C Contacts Passing Steady Currents for Long Time Periods, IEEE Trans. Compon. Hybrids Manuf. Technol., 1986, 9(1), p 3鈥?6CrossRef
3.C.-H. Leung and H.J. Kim, A Comparison of Ag/W, Ag/WC, and Ag/Mo Electrical Contacts, IEEE Trans. Compon. Hybrids Manuf. Technol., 1984, 7(1), p 69鈥?5CrossRef
4.T. Bregel, W. Krauss-Vogt, R. Michal, and K.E. Saeger, On the Application of W/Cu Materials in the Fields of Power Engineering and Plasma Technology, IEEE Trans. Compon. Hybrids Manuf. Technol., 1991, 14(1), p 8鈥?3CrossRef
5.C.-H. Leung and P.C. Wingert, Microstructure Effects on Dynamic Welding of Ag/W Contacts, IEEE Trans. Compon. Hybrids Manuf. Technol., 1988, 11(1), p 64鈥?7CrossRef
6.C.-H. Leung, P.C. Wingert, and H.J. Kim, Comparison of Reignition Properties of Several Ag/W, Ag/WC, and Ag/Mo Electrical Contact Materials, IEEE Trans. Compon. Hybrids Manuf. Technol., 1986, 9(1), p 86鈥?1CrossRef
7.T. Mutzel and R. Niederreuther, Development of Contact Material Solutions for Low-Voltage Circuit Breaker Applications (2), Proceedings of the 57th IEEE Holm Conference on Electrical Contacts, September 11-14, 2011, p 1鈥?
8.J.J. Shea, Erosion and Resistance Characteristics of AgW and AgC Contacts, IEEE Trans. Compon. Packag. Technol., 1999, 22(2), p 331鈥?36CrossRef
9.F. Findik and H. Uzun, Microstructure, Hardness and Electrical Properties of Silver-Based Refractory Contact Materials, Mater. Des., 2003, 24(7), p 489鈥?92CrossRef
10.T. Mutzel, P. Braumann, and R. Niederreuther, Development of Contact Material Solutions for Low-Voltage Circuit Breaker Applications (1), Proceedings of the 56th IEEE Holm Conference on Electrical Contacts, October 4-7, 2010, p 1鈥?
11.P.G. Slade, Effect of the Electric Arc and the Ambient Air on the Contact Resistance of Silver, Tungsten, and Silver-Tungsten Contacts, J. Appl. Phys., 1976, 47(8), p 3438鈥?443CrossRef
12.P. Borkowski, E. Walczuk, K. Frydman, and D. Wojcik-Grzybek, Switching Properties of Contacts Made of Silver-Tungsten And Silver-Tungsten-Rhenium Composite Materials, Proceedings of the 59th IEEE Holm Conference on Electrical Contacts, September 22-25, 2013, p 1鈥?0
13.P.C. Wingert, The Detection and Effects of Oxide Layers on Silver-Refractory Contact Surfaces, Proceedings of the 43rd IEEE Holm Conference on Electrical Contacts, October 20-22, 1997, p 104鈥?14
14.M. Lindmayer and M. Roth, Contact Resistance and Arc Erosion of W/Ag and WC/Ag, IEEE Trans. Compon. Hybrids Manuf. Technol., 1979, 2(1), p 70鈥?5CrossRef
15.K. Kaliszuk, K. Frydman, D. Wojcik-Grzybek, W. Bucholc, E. Walczuk, P. Borkowski, and D. Zasada, Arc Erosion Tests and Study of Surface of Ag-WC Contacts After Arc Switching Operations, Proceedings of the 50th IEEE Holm Conference on Electrical Contacts and the 22nd International Conference on Electrical Contacts, September 20-23, 2004, p 75鈥?2
16.O. Kubaschewski and B.E. Hopkins, Oxidation of Metals and Alloys, 2nd ed., Butterworths, London, 1962
17.M. Braunovic, V.V. Konchits, and N.K. Myshkin, Electrical Contacts: Fundamentals, Applications and Technology, CRC Press, Boca Raton, 2006CrossRef
18.P.G. Slade, W. Li, L.D. Loud, and R.E. Haskins Jr., The Unusual Electrical Erosion of High Tungsten Content, Tungsten Copper Contacts Switching Load Current In Vacuum, Proceedings of the 46th IEEE Holm Conference on Electrical Contacts, September 25-27, 2000, p 139鈥?52
19.V. Behrens, T. Honig, and A. Kraus, Tungsten and Tungsten Carbide Based Contact Materials Used in Low Voltage Vacuum Contactors, Proceedings of the 45th IEEE Holm Conference on Electrical Contacts, October 4-6, 1999, p 105鈥?10
20. Standard for Safety, Molded-Case Circuit Breakers, Molded-Case Switches, and Circuit-Breaker Enclosures, ANSI/UL Standard 489, 1996
21.C.W. Kimblin and R.W. Long, Low-Voltage Power Circuit Breakers and Molded Case Circuit Breakers鈥擜 Comparision of Test Requirements, IEEE Industrial and Commercial Power Systems Technical Conference, August, 1999
22.M. Higginson and D.B. Durocher, Proper Application & Maintenance of Molded Case Breakers to Assure Safe and Reliable Operation, IEEE IAS Electr. Saf. Workshop, 2009, 2-6, p 1鈥?2
23.Z. Aslanoglu, Y. Karaka艧, M.L. 脰ve莽oglu, and B. 脰zkal, Effects of Nickel Addition on Properties of Ag-W Electrical Contact Materials, Powder Metall., 2001, 44(1), p 77鈥?1CrossRef
24.G.J. Witter and W.R. Warke, A Correlation of Material Toughness, Thermal Shock Resistance, and Microstructure of High Tungsten, Silver-Tungsten Composite Materials, IEEE Trans. Parts Hybrids Packag., 1975, 11(1), p 21鈥?9CrossRef
25.C.W. Corti, Sintering Aids in Powder Metallurgy, Platin. Met. Rev., 1986, 30(4), p 184鈥?95
26.H. Yu, Y. Sun, S.P. Alpay, and M. Aindow, Microstructure Effects in Braze Joints Formed Between Ag/W Electrical Contacts and Sn-Coated Cu using Cu-Ag-P Filler Metal, J. Mater. Sci., 2015, 50(1), p 324鈥?33CrossRef
27. Standard Practice for Construction and Use of a Probe for Measuring Electrical Contact Resistance, ASTM Standard B 667-97, 2009
28.J. Shea and J.A. Bindas, Measuring Molded Case Circuit Breaker Resistance, IEEE Trans. Compon. Hybrids Manuf. Technol., 1993, 16(2), p 196鈥?02CrossRef
29.P.G. Slade, The Switching Performance of Refractory Carbide-Silver Contacts, IEEE Trans. Compon. Hybrids Manuf. Technol., 1979, 2(1), p 127鈥?33CrossRef
30.M. Antler, Survey of Contact Fretting in Electrical Connectors, IEEE Trans. Compon. Hybrids Manuf. Technol., 1985, 8(1), p 87鈥?04CrossRef
31.A. Beloufa, Conduction Degradation by Fretting Corrosion Phenomena for Contact Samples Made of High-Copper Alloys, Tribol. Int., 2010, 43(11), p 2110鈥?119CrossRef
32.I.H. Brockman, C.S. Sieber, and R.S. Mroczkowski, A Limited Study of the Effects of Contact Normal Force, Contact Geometry and Wipe Distance on the Contact Resistance of Gold-Plated Contacts, Proceedings of the 38th Electronics Components Conference, May 9-11, 1988, p 198鈥?07
33.R. Diehl, G. Brandt, and E. Salje, The Crystal Structure of Triclinic WO3, Acta Crystallogr. Sect. B, 1978, 34, p 1105鈥?111CrossRef
34.S.S. Kabalkina, S.V. Popova, N.R. Serebryanaya, and L.F. Vereshchagin, A New Modification of Ag2O with Layered Structure, Dokl. Akad. Nauk SSSR, 1963, 152, p 853鈥?54
35.P.M. Skarstad and S. Geller (W4O16)8鈭?/sup> Polyion in the High Temperature Modification of Silver Tungstate, Mater. Res. Bull., 1975, 10(8), p 791鈥?00CrossRef
36.B.M. Gatehouse and P. Leverett, Crystal Structures of Silver Dimolybdate, Ag2Mo2O7, and Silver Ditungstate, Ag2W2O7, J. Chem. Soc. Dalton, 1976, 5, p 1316鈥?320CrossRef
37.P.C. Wingert, Testing of the Thermal-Stress-Cracking Characteristics of Silver-Refractory Contacts, Proceedings of the 41st IEEE Holm Conference on Electrical Contacts, October 2-4, 1995, p 338鈥?45
38.P.C. Wingert, The Effects of Nickel on the Switching Performance of Silver-Tungsten-Based Contacts, Proceedings of the 39th IEEE Holm Conference on Electrical Contacts, September 27-29, 1993, p 111鈥?15
39.J.J. Shea, Polymeric Arc Chamber Walls Influence on AGW/AGC Contact Resistance, IEEE Trans. Compon. Packag. Technol., 2000, 23(2), p 205鈥?10CrossRef
40.T. Takemoto, I. Okamoto, and J. Matsumura, Phase Diagram of Cu-Ag-P and Cu-Sn-P Ternary Brazing Filler Metals, Trans. JWRI, 1987, 16(2), p 73鈥?9
41.H. Yu, Y. Sun, S.P. Alpay, and M. Aindow, Characterization of the Surface Layer of Ag/W Electrical Contacts, Microsc. Microanal., 2014, 20(Suppl. 3), p 860鈥?61CrossRef
42.N. Kaneki, H. Hara, K. Shimada, and T. Shimizu, Effect of Atmosphere on Resistivity of WO3 Ceramics, J. Am. Ceram. Soc., 1976, 59(7鈥?), p 368鈥?69CrossRef
43.Y. Abe, T. Hasegawa, M. Kawamura, and K. Sasaki, Characterization of Ag Oxide Thin Films Prepared by Reactive RF Sputtering, Vacuum, 2004, 76(1), p 1鈥?CrossRef
44.A. Sreedevi, K.P. Priyanka, S.R. Mary, E.M. Mohammed, and T. Varghese, Nanophase 伪-Silver Tungstate for Potential Applications in Light Emitting Diodes and Gate Dielectrics, Adv. Sci. Eng. Med., 2015, 7(6), p 498鈥?05CrossRef
45.R. Michal and K.E. Saeger, Metallurgical Aspects of Silver-Based Contact Materials for Air-Break Switching Devices for Power Engineering, IEEE Trans. Compon. Hybrids Manuf. Technol., 1989, 12, p 71鈥?1CrossRef
46.C.-H. Leung, R.C. Bevington, P.C. Wingert, and H.J. Kim, Effects of Processing Methods on the Contact Performance Parameters for Silver-Tungsten Composite Materials, IEEE Trans. Compon. Hybrids Manuf. Technol., 1982, 5(1), p 23鈥?1CrossRef - 作者单位：Haibo Yu (1)
Yu Sun (1)
M. Tumerkan Kesim (1)
Jason Harmon (2)
Jonathan Potter (2) (3)
S. Pamir Alpay (1)
Mark Aindow (1)
1. Department of Materials Science and Engineering, Institute of Materials Science, University of Connecticut, Storrs, CT, 06269-3136, USA
2. GE Energy Management - Industrial Solutions, Plainville, CT, 06062, USA
3. Honeywell Fire Safety, Northford, CT, USA - 刊物类别：Chemistry and Materials Science
- 刊物主题：Chemistry
Characterization and Evaluation Materials
Materials Science
Tribology, Corrosion and Coatings
Quality Control, Reliability, Safety and Risk
Engineering Design - 出版者：Springer New York
- ISSN：1544-1024
文摘
The near-surface microstructure of Ag/W contacts from 120 V, 30 A commercial circuit breakers in the as-manufactured condition and after standardized UL overload/temperature-rise, endurance, and short-circuit testing have been investigated using a combination of x-ray diffraction, scanning electron microscopy, energy-dispersive x-ray spectroscopy, focused ion beam milling, and transmission electron microscopy. The as-manufactured contacts comprised three constituents: sintered Ag/W composite particles with fine-grained Ag and coarse-grained W, coarse-grained pockets of Ag infiltrate, and a nano-crystalline surface Ag layer. There are also WO3 and Ag2O phases at the surface. After UL overload/temperature-rise testing, there is Ag loss giving a porous W-rich layer at the contact surface. In addition to binary oxides, we observe the formation of Ag2WO4. After UL endurance testing, material is swept across the surface by the breaker action giving a W-rich eroded porous surface on one side and a build-up of mixed oxides on the other. After UL short-circuit testing, a W crust forms due to melting and re-solidification of W and vaporization of Ag, and mid-plane cracks form due to the severe thermal gradients. There is a strong correlation between the observed microstructural features and the contact resistance measurements obtained from these samples. Keywords circuit breaker contacts contact resistance electron microscopy UL testing