Effects of Sulfur on the Properties of Sn-9Zn as Lead-Free Solder

详细信息    查看全文

• 作者：Xiuqin Wei ; Yinghui Li ; Huizhen Huang
• 关键词：Sn ; 9Zn ; lead ; free solder ; sulfur ; wettability ; corrosion
• 刊名：Journal of Electronic Materials
• 出版年：2017
• 出版时间：February 2017
• 年：2017
• 卷：46
• 期：2
• 页码：1067-1071
• 全文大小：
• 刊物类别：Chemistry and Materials Science
• 刊物主题：Optical and Electronic Materials; Characterization and Evaluation of Materials; Electronics and Microelectronics, Instrumentation; Solid State Physics;
• 出版者：Springer US
• ISSN：1543-186X
• 卷排序：46

文摘

The effects of sulfur on the wettability of Sn-9Zn on Cu, and on the corrosion of the alloy were examined by means of spreading tests and potentiodynamic polarization tests, respectively. Sulfur improves the wettability of Sn-9Zn when its content in the alloy is in the range 0.015–0.1 wt.% and the optimal S content is 0.02 wt.%. In potentiodynamic polarization tests, sulfur did not significantly affect the corrosion potential or corrosion current, but increasing the sulfur increased the passivation current density. The mechanisms underlying these effects of sulfur on the properties of Sn-9Zn are discussed.